Press Release: VIA Releases Special Edition of the VIA C3™ 800MHz Processor "Cool Chip In A Can" Packaging

Posted By Kathy Smith

Date: September 20, 2001

For Immediate Release:
Provides distinctive display item that stands out on the crowded retail shelf

Taipei, Taiwan, 20 September 2001 –
VIA Technologies, Inc, a leading innovator and developer of core logic chipsets, microprocessors, and multimedia and communications chips, today launched a special edition of the VIA C3™ 800MHz processor in distinctive new packaging. Available in limited quantities only, the unique "cool chip in a can" packaging will be distributed first in Japan and will later be released worldwide through VIA’s global distribution channels.

In stark contrast to the industry’s standard retail box designs, the special edition package consists of a brightly colored alloy container that measures 7.3cm (height) X 10.5cm (caliber). Its contents are the same as the standard VIA C3™ processor retail box, which includes a ball-bearing fan and heatsink, as well as a multi-lingual installation manual and three-year limited warranty. Hologram stickers guarantee the authenticity of the processor and ensure peace of mind for both retailers and consumers.

"The distinctive design of the VIA C3™ processor special edition packaging breaks the mould of conventional retail box designs for processors and other chip products," commented Richard Brown, Director of Marketing for VIA Technologies, Inc. "It provides resellers with a cool-looking yet robust display item that stands out on the crowded retail shelf."

VIA C3 Processor

Available at speeds of up to 866MHz, the VIA C3 is the first processor in the world to be manufactured using leading-edge 0.13 and 0.15 micron manufacturing processes and boasts the world’s smallest x86 processor die size. As the coolest running processor on the market today, the VIA C3 delivers ultra low power consumption and world class levels of stability. It is fully Socket 370 compatible and comes with 128KB Level 1 and 64KB Level 2 full speed cache, as well as support for a 100/133MHz Front Side Bus and MMX and 3DNow! multimedia instructions, to ensure robust levels of performance for all the most popular mainstream software and Internet applications.

About VIA Technologies, Inc.

VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia and communications chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, as well as cost-effective VIA C3™ processors for Value PCs and Internet Appliances. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2000. Additional information can be found at www.via.com.tw.


VIA Web Media PR Contacts

John Gatt
Ph: 61 3 9766 8566

Fiona Gatt
Ph: 61 3 9766 8566

Note to reporters, editors and writers: VIA is spelled in ALL CAPS.