Press Release: VIA Unveils New Ultra-Compact Mini-iTX Mainboard Reference Design
Posted By Kathy Smith
Date: November 6, 2001
Provides the smallest and most highly-integrated
platform for building new generation of innovative small footprint Information
Station and Information Server Appliance Designs.
Taipei, Taiwan, 6 November 2001 - VIA Technologies, Inc, a leading innovator and developer of core logic chipsets, microprocessors, and multimedia and communications chips, today announced the launch of its new ultra compact VIA VT6010 Mini-iTX mainboard form factor reference design.
Developed as part of the company's open industry-wide Total Connectivity initiative, the new VIA VT6010 Mini-iTX mainboard reference design packs a full set of features, including an onboard VIA C3 E-Series EBGA processor, as well as integrated AGP graphics and audio, on a board that is 50% smaller than the FlexATX form factor, to provide OEMs and System Integrators with the smallest and most cost effective "system on a mainboard" solution for building the fast emerging new generation of highly affordable small footprint PC and Information Appliance system designs. Leveraging the low power consumption and highly efficient heat dissipation of the VIA C3 E-Series processor, the new Mini-iTX mainboard also enables the development of innovative fanless noise free system designs.
"The introduction of the new Mini-iTX mainboard reference
design underscores our commitment to implementing our Total Connectivity
vision," commented Richard Brown, Director of International Marketing of VIA
Technologies, Inc. "With the new Mini-iTX mainboard, OEMs and System Integrators
can quickly expand their product lines to take advantage of the opportunities
offered by this rapidly emerging new market for smaller, more innovative, and
quieter system designs."
Ultra Compact VIA VT6010 Mini-iTX Form Factor Mainboard Reference Design
The new Mini-iTX mainboard form factor provides mainboard makers, system integrators, and OEMs with a standardized ultra compact yet highly integrated platform that can be utilized across multiple ultra Value PC, Information Station, Information Server, and Broadband Gateway product lines. With a footprint that measures only 170mm x 170mm, the new Mini-iTX form factor is more than 40% smaller than any other mainboard form factor currently available on the market. It also comes with a rich feature set that includes a high speed x86 processor running at speeds of up to 800MHz, integrated AGP graphics and audio, a TV-Out connector, Ethernet networking, and SPDIF 5.1 audio channels that are not available on other small form factor mainboards.
An added advantage of the Mini-iTX mainboard is that it comes with a VIA C3 E-Series EBGA processor. The VIA C3 processor has built a strong reputation for its reliable cool performance and unbeatable value. Its cool nature makes it the logical choice for small, low power, quiet and silent system designs where passive processor cooling is extremely beneficial. Furthermore, the Mini-iTX mainboard combines the cool value combination of the VIA C3 processor with the VIA Apollo PLE133 chipset enabling its robust yet quiet operation.
More information about the new ultra compact Mini-iTX form
factor can be found in the company's newly published White Paper, entitled "New
Mini-iTX Mainboard Specification White Paper". This can be downloaded from the
VIA website at www.viatech.com.
VIA C3 E-Series Processor
The VIA C3 is the first processor in the world to be manufactured using leading-edge 0.13 and 0.15 micron manufacturing processes, and boasts the world's smallest x86 processor die size of only 52mm². As the coolest running processor on the market today, the VIA C3 E-series processor delivers power consumption to as little as below one watt when running in optimized low voltage mode. Its highly efficient heat dissipation properties mean that the VIA C3 E-Series processor doesn't require active cooling, allowing designers ample room for innovation and cost saving when developing fanless, space saving systems in small form factors. It is fully Socket 370 compatible and is available at speeds of up to 866MHz. It also comes with 128KB Level 1 and 64KB Level 2 full speed cache, as well as support for a 100/133MHz Front Side Bus and MMX and 3DNow! multimedia instructions, to ensure robust levels of performance for all popular mainstream software and Internet applications.
About VIA Technologies, Inc.
VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia and communications chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3 processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2000. Additional information can be found at www.via.com.tw.
Note to reporters, editors and writers: VIA is spelled in ALL CAPS.
Phone: 1- 510-687-4678