SANTA CLARA, Calif., December 12, 2001 - Intel Corporation today announced it has reached a settlement agreement with Via Technologies Inc. in a pending patent litigation related to chipsets that support Advanced Micro Devices microprocessors. The agreement was reached after Via redesigned its products in an effort to avoid infringing on Intel's patents.

Under terms of the settlement, Intel will drop its patent infringement suit regarding U.S. Patent Nos. 5,926,651 and 5,051,622, which was scheduled for trial on Jan. 22. Intel retains all of its rights to the patents and could bring suit at a later time if future infringement occurs. This settlement does not affect litigation between Intel and Via pending in U.S. District Court in Delaware, U.S. District Court in Texas, in the United Kingdom, in Germany or in Hong Kong, with respect to the Via P4X266 chipsets and the C3 microprocessor.

Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom

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For additional information about this news release, visit the Intel Press Room at: http://www.intel.com/pressroom/archive/releases/20011212corp.htm
 

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